Detailansicht
An Introduction to Surface-Micromachining
ISBN/EAN: 9781475710779
Umbreit-Nr.: 5539495
Sprache:
Englisch
Umfang: xiii, 189 S., 168 s/w Illustr.
Format in cm:
Einband:
kartoniertes Buch
Erschienen am 12.12.2012
Auflage: 1/2004
- Zusatztext
- An Introduction to Surface-Micromachining provides for the first time a unified view of surface-micromachining. Building up from the basic building block of microfabrication techniques, to the general surface-micromachining design, it will finish with the theory and design of concrete components. An Introduction to Surface-Micromachining connects the manufacturing process, microscale phenomena, and design data to physical form and function. This book will be of interest to mechanical engineers looking to scale down into micromachining and microelectronics designers looking to move horizontally to micromachining.
- Autorenportrait
- Inhaltsangabe1. Introduction.- 1.1 Why miniaturize?.- 1.2 Why surface-micromachining?.- 1.3 History.- References.- I Fabrication.- 2. Microfabrication Processes.- 2.1 Photolithography.- 2.2 Thermal Growth.- 2.3 Deposition.- 2.4 Etching.- 2.5 Doping.- 2.6 Chemical Mechanical Polishing (CMP).- 2.7 Wafer Bonding.- 2.8 Release.- 2.9 Wire Bonding.- References.- 3. Micromachining Technologies.- 3.1 Bulk Micromachining.- 3.2 LIGA.- 3.3 Surface-Micromachining.- References.- II Design.- 4. Microscale Physics.- 4.1 Scaling Laws.- 4.2 Casimir Force.- 4.3 Surface Forces.- 4.4 Friction.- 4.5 Continuum Mechanics Approximation.- References.- 5. Mechanics.- 5.1 Beam Equations.- 5.2 Torsion.- 5.3 Cantilevers.- 5.4 Euler-columns.- 5.5 Pseudo-rigid body Modelling.- References.- 6. Design Rules.- 6.1 Minimum Geometry Rules.- 6.2 Maximum Geometry Rules.- 6.3 Minimum Enclosure Rules.- 6.4 Minimum Overlap Rules.- 6.5 Design Rule Checks (DRC).- 7. Non-Ideal Processes.- 7.1 Topography.- 7.2 Dimensional Tolerances.- 7.3 Thin-film Stresses.- References.- 8. Design Techniques.- 8.1 Ground Planes.- 8.2 Double Thickness Parts.- 8.3 Conducting Paths.- 8.4 Tethers.- 8.5 Dimples.- 8.6 Process Variations.- References.- III Devices.- 9. Electrical Components.- 9.1 Bonding Pads.- 9.2 Resistors.- 9.3 Capacitors.- 9.4 Inductors.- References.- 10. Mechanical Components.- 10.1 Compliant Devices.- 10.2 Springs.- 10.3 Suspensions.- 10.4 Flexure Joints.- 10.5 Levers.- References.- 11. Electrostatic Actuators.- 11.1 Parallel-Plate Actuators.- 11.2 Interdigitated Comb Actuators.- 11.3 Curved Electrode Actuators.- 11.4 Scratch-drive Actuators.- References.- 12. Electro-Thermal-Compliant Actuators.- 12.1 Thermal Bimorph Actuators.- 12.2 Guckel Actuators.- 12.3 Bent-beam Actuators.- 12.4 Topological Optimization.- References.- 13. Raised Structures.- 13.1 Hinges.- 13.2 Assembly.- References.- IV Processes.- 14. PolyMUMPsTM Process.- 14.1 Design Rules.- 14.2 Photo Gallery.- References.- 15. SUMMiTTM Process.- 15.1 Design Rules.- 15.2 Photo Gallery.- 16. MUSiC® Process.- 16.1 Design Rules.- 16.2 Photo Gallery.- References.